Method and apparatus to support a cleanspace fabricator

ABSTRACT

The present invention provides various aspects of support for a fabrication facility capable of routine placement and replacement of processing tools. Support aspects include support structure for processing tools, a clean environment carrier for a single substrate and a quick disconnect flange which facilities connecting and disconnect of electrical, liquid and gas utilities to a processing tool placed in the fabricator. Methods of installing processing tools and for producing substrates in this environment are provided.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in part to the United States PatentApplications bearing the Ser. Nos. 11/502689, filed Aug. 12, 2006 andentitled: “Method and Apparatus to support a Cleanspace Fabricator”which claims priority to the following Provisional Applications:Provisional Application, Ser. No. 60/596343, filed Sep. 18, 2005 andentitled: “Specialized Methods for Substrate Processing for a CleanSpace Where Processing Tools are Vertically Oriented”; and alsoProvisional Application, Ser. No. 60/596173, filed Sep. 6, 2005 andentitled: “Method and Apparatus for Substrate Handling for a Clean SpaceWhere Processing Tools are Reversibly Removable”; and also ProvisionalApplication, Ser. No. 60/596099, filed Aug. 31, 2005 and entitled:“Method and Apparatus for a Single Substrate Carrier For SemiconductorProcessing”; and also Provisional Application, Ser. No. 60/596053 filedAug. 26, 2005 and entitled: “Method and Apparatus for an Elevator Systemfor Tooling and Personnel for a Multilevel Cleanspace/Fabricator”; andalso Provisional Application, Ser. No. 60/596035 filed Aug. 25, 2005 andentitled: “Method and Apparatus for a Tool Chassis Support System forSimplified, Integrated and Reversible Installation of Process Tooling”;and also Provisional Application, Ser. No. 60/595935 filed Aug. 18,2005, and entitled: “Method and Apparatus for the Integrated, Flexibleand Easily Reversible Connection of Utilities, Chemicals and Gasses toProcess Tooling.” The contents of each are relied upon and incorporatedby reference.

FIELD OF THE INVENTION

The present invention relates to apparatus and methods which supportfabricators with routinely replaceable processing tools and one or morecleanspaces.

BACKGROUND OF THE INVENTION

A known approach to cleanspace-assisted fabrication of materials such assemi-conductor substrates, is to assemble a manufacturing facility as a“cleanroom.” In such cleanrooms, processing tools are arranged toprovide aisle space for human operators or automation equipment.Exemplary cleanroom design is described in: “Cleanroom Design SecondEdition,” edited by W. Whyte, published by John Wiley & Sons, 1999, ISBN0-471-94204-9, (herein after referred to as “the Whyte text”).

Cleanroom design has evolved over time to include locating processingstations within clean hoods. Vertical unidirectional air flow can bedirected through a raised floor, with separate cores for the tools andaisles. It is also known to have specialized mini environments whichsurround only a processing tool for added space cleanliness. Anotherknown approach includes the “ballroom” approach, wherein tools,operators and automation all reside in the same cleanroom.

Evolutionary improvements have enabled higher yields and the productionof devices with smaller geometries. However, known cleanroom design hasdisadvantages and limitations.

For example, as the size of tools has increased and the dimensions ofcleanrooms have increased, the volume of cleanspace that is controlledhas concomitantly increased. As a result, the cost of building thecleanspace, and the cost of maintaining the cleanliness of suchcleanspace, has increased considerably.

Tool installation in a cleanroom can be difficult. The initial “fit up”of a “fab” with tools, when the floor space is relatively empty, can berelatively straight forward. However, as tools are put in place and afab begins to process substrates, it can become increasingly difficultand disruptive of job flow, to either place new tools or remove oldones. It would be desirable therefore to reduce installationdifficulties attendant to dense tool placement while still maintainingsuch density, since denser tool placement otherwise affords substantialeconomic advantages relating to cleanroom construction and maintenance.

Another area of evolutionary improvement has come with improvements inrobotics. Substrate processing has changed from a manually intensiveprocess where human operators handled substrates or batches ofsubstrates. In current cleanroom designs, many processing tools includerobotics for substrate handling. In some fabricator settings, humaninteraction is reduced to: loading collections of substrates ontoprocessing tools, unloading collections of substrates from processingtools and moving collections of substrates from one processing tool toanother. Evolutionary advances have transitioned into cleanroom roboticswhich are extremely complex and therefore costly and error prone.

In some cases, in a modem semiconductor fabricator, substrates move fromtool to tool in specialized carriers which contain multiple substrates.The carriers interface with appropriate automation to allow for movementof the substrates around the fab and for loading and unloading thesubstrates from a processing tool.

The size of substrate has increased over time as have the typical sizesof fabs. The increased size allows for economies of scale in production,but also creates economic barriers to development and new entries intothe industry. A similar factor is that the processing of substrates iscoordinated and controlled by hatching up a number of substrates into asingle processing lot. A single lot can include, for example, 25substrates. Accordingly, known carriers are sized to typicallyaccommodate the largest size lot that is processed in a fab.

It would be desirable to have manufacturing facilities forcleanspace-assisted fabrication, that use less cleanspace area, permitdense tool placement while maintaining ease of installation, whichpermit the use of more simple robotics and which are capable ofefficiently processing a single substrate.

SUMMARY OF THE INVENTION

Accordingly, the present invention provides support mechanisms for afabrication environment that includes a cleanspace with a boundary walland a plurality of processing tools, each having a port and a body. Theprocessing tools can be placed with each port inside the firstcleanspace and the body of each processing tool can be placed at alocation peripheral to the cleanspace boundary wall, such that at leasta portion of the tool body is outside the cleanspace. In addition, asingle material, such as a single substrate wafer, can be processed byat least two of the plurality of tools and individually transferred froma first tool to a second tool within the integrity of the cleanspace.

The present invention can therefore include methods and apparatus for:supporting processing tools, supplying utilities to the processingtools, handling material to be processed within the cleanspace;transporting materials within the cleanspace and placing a processingtool into and out of physical communication with the cleanspace.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, that are incorporated in and constitute apart of this specification, illustrate several embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention:

FIG. 1 Overview of Chassis Embodiment

FIG. 2 Front View with Tool Body Placed

FIG. 3 Rear View with Tool Body Placed

FIG. 4 Example Placement in an Example Fab Design

FIG. 5 Overview of Chassis-Not Extended

FIG. 6 illustrates an example tool body elevation view showing asubstrate handler.

FIG. 7 illustrates a close up view of substrate handler indicatinginternal components in context with a tool body.

FIG. 8 Substrate Handler Internal Components.

FIG. 9 illustrates a tool body with substrate handler attached to anexemplary fabricator.

FIG. 10 illustrates a rear view plane view of an exemplary fabricatorwith back walls removed and thereby showing multiple tool ports andfabricator automation.

FIG. 11 illustrates a single level carrier with clips and ramped supportrails.

FIG. 12 illustrates a Cross Section of A single level carrier with Clipsand Ramped Support Rail.

FIG. 13 illustrates a single level Carrier with a substrate shaped sloton support rails.

FIG. 14 illustrates an elevation of an open single level carrier with asubstrate shaped slot on support rails.

FIG. 15 illustrates a cross section of an open single level carrier witha substrate shaped slot on support rails.

FIG. 16 illustrates an elevation of a double level carrier with clipsand ramped support rails.

FIG. 17 illustrates an elevation of an open double level carrier withclips and ramped support rails and vent holes in top transparent panel.

FIG. 18 illustrates a side view of an open double level carrier withclips and ramped support rails and vent holes in top transparent panel.

FIG. 19 illustrates an elevation of a double level carrier with ventholes in top panel and environmental control unit attached to top panel.

FIG. 20 illustrates an elevation of an open single level carrier with asubstrate shaped slot on support rails with helical springs.

FIG. 21A illustrates a Multiple Gas Flange Top

FIG. 21B illustrates a Bottom view of Multiple Gas Flange

FIG. 22 illustrates an assembly including two faces of a multiple gasconnection.

FIG. 23 illustrates a bottom elevation of joined multiple gas connection

FIG. 24 illustrates an entity sealed with bolts.

FIG. 25 illustrates an entity sealed clamped force

FIG. 26 illustrates an entity with motorized sealing concept

FIG. 27 illustrates an implementation of a single gas or fluid.

FIG. 28 illustrates an example of a liquid version of a quick sealingmechanism.

FIG. 29 illustrates an “exploded” version of a chemical flange.

FIG. 30 illustrates a “manifold” of various types of quick connectionflanges.

FIG. 31 illustrates a schematic representation implementing someembodiments of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention relates to methods and apparatus to support acleanspace environment within which a material, such as an integratedcircuit substrate, can be processed. The support can include methods andapparatus which allow a portion of a tool used to process the materialto be accessible from within a cleanspace in which the material isprocessed. An additional portion of the processing tool can remainoutside of the cleanspace environment in which the material isprocessed. In addition, the present invention provides for methods andapparatus to facilitate installation, removal and maintenance of thetools used to process the material.

Reference will now be made in detail to different aspects of somepreferred embodiments of the invention, examples of which areillustrated in the accompanying drawings. Wherever possible, the samereference numbers will be used throughout the drawings to refer to thesame or like parts. A Glossary of Selected Terms is included at the endof this Detailed Description.

Traditionally, when installing a processing tool into a semiconductorfabricator, riggers had to place the tool in a designated position wherethe tool remained in place for its entire time in the fab. The presentinvention provides for an alternative strategy wherein processing toolscan be routinely placed and removed from a fab location.

One aspect of the present invention therefore provides for supportfixtures which facilitate efficient placement, removal and replacementof a processing tool in a predefined location. Predefined tool placementin turn facilitates predefined locations for utility interconnectionsand predefined locations for material transfer into and out ofassociated tool ports. In some embodiments, a support fixture canfurther provide a chassis capable of receiving a processing tool andmoving a processing tool from a position external to a cleanspace to anoperational location wherein at least an associated processing tool portis located inside the cleanspace environment. In some respects, movementof the tool from an installation position to an operational position canbe envisioned much like a cabinet drawer moving from an outward positionto a closed position.

Other aspects of some embodiments of the present invention include theconnection of support items for proper operation of the processing tool.For example, electrical supplies, chemicals, gases, compressed air orother processing tool support can be passed through the tool chassissupport system via flexible connections. Furthermore, wired or wirelesstransfer of data could be supported by the chassis body. In addition, insome embodiments, a support chassis according to the present inventioncan include communication interfaces with safety systems to provide safeoperation and safe removal and replacement.

Referring now to FIG. 1 a tool chassis 101 is illustrated according tosome embodiments of the present invention. Base plates 110-111 attachedto a sliding rail system 113 provide an installation location for aprocessing tool body (not illustrated). Base plate 111 is physicallyfixed in an appropriate location of a fabricator. In some embodiments,base plate 111 would not interact directly with the tool body, however,in some embodiments, a tool body can be fixedly attached to the baseplate 111. In both embodiments, base plate 110 can physically support atool body mounted on the tool support chassis 101.

In FIG. 1, the orientation of two base plates 110-111 is shown with thebase plates separated. The chassis 101 can have multiple servicelocation orientations. A first location, as shown in the drawing, caninvolve an extended location, such that the placement and removal of atool body from the base plate 110 can occur in an exposed location. Anexposed location, for example, can facilitate placement of a new toolonto the chassis 110. A second service location allows the chassis 101to relocate such that both chassis plates 110 and 111 are closetogether. An illustration of an exemplary second service location isprovided in FIG. 5 including plates 510 and 511.

In some embodiments, physical tabs 120 may stick out of the chassis topplate 110. The physical tabs 120 may serve one or more purposes. As aphysical extension, the tabs 120 will have a corresponding indentation(not illustrated) in the mating plate or a surface of a tool body 201 tobe placed on the tabs 120. As the tool body 201 is lowered over thechassis 110, the tool body 201 will reach a location as defined by tabs120. In some embodiments, the tabs 120 can additionally provideelectrical connection between the chassis top plate 110 and the toolbody 201. Electrical connection can serve one or more of the purposesof: electrical power and electrical data signal.

In some embodiments, a wireless interface 123 can provide wirelesselectrical connection between the tool body and the chassis. Thewireless interface 123 can be redundant to hardwire data connections ortake the place of hardwire data connection. The wireless interface canalso be utilized for other electrical connections, as discussed foritems. In some embodiments, a wireless coupling 123 can provide one orboth of electrical power and data communication.

Connections for non-electrical utilities 121 can also be provided, asdiscussed more fully below in the section entitled Utility FlangeConnectors. Fixtures 121 can be used for defining a connection, forexample, of one or more of: gas, vacuum, fluids waste lines, compressesair, deionized water, chemicals and the like. Various conduits 112 cancarry these utilities to the fixtures 121 and be routed, for example,through the chassis 101. The conduits 112 can be connected toappropriate facility supply systems, air flow systems and drains toprovide for safe operation.

Referring now to FIG. 2, a tool body 201 can be placed onto the chassisplate 110. The tool body 201 is illustrated in a generic box, however,any type of processing tool, such as those required for semiconductormanufacture, is within the scope of the invention. In some embodiments,the underside of a tool body 201 can include a mating plate whichphysically interfaces with a chassis top plate 202.

The present invention includes apparatus to facilitate placement ofprocessing tool bodies 201 in a fab and the methods for using suchplacement. The chassis 101 design can be capable of assuming two definedpositions; one extended position places an interface plate external tothe environment that the tool assumes when it is processing. This allowsfor easy placement and removal. The other position can be the locationwhere the tooling sits when it is capable of processing. The exactplacement of the tooling afforded by the chassis 101 allows for morerational interconnection to facilities and utilities and also for theinterfacing of the tool body 201 with fab automation. The chassis 101can have automated operations capabilities that interface with the toolbody and the fab operation to ensure safe controlled operation.

In another aspect of the invention, a processing tool 200 can transfer amaterial, such as, for example, a semiconductor substrate, in and out ofa tool body 201. In FIG. 2, a tool port 211 can be used for coordinatingtransfer of a material into and out of the tool port 211 and maintainingcleanspace integrity of a tool body 201 interior. As can be seen in FIG.2 this embodiment contemplates placing the tool port 211 in a mannerphysically connected to the tool body 201. A further purpose of themovement of the chassis plate 110 from its extended position to itsclosed position would be the movement of the tool port 211 through anopening in a clean space wall. This would allow the tool port 211 tooccupy a position in a clean space so that fabricator logisticsequipment can hand off wafers and carriers of wafers to the tool port211.

Referring now to FIG. 3, in some embodiments, a tool body 201 caninclude a specifically located set of mating pieces 310 for connectingthe tool body 201 to facility supplied utilities. When the tool andchassis are moved from an extended position as shown in FIG. 1 to aclosed position as shown in FIG. 5, such movement can place toolconnections 310 in proximity to the facilities connections 121 andthereby allow for connection of various utilities. In some embodiments,as a processing tool 200 is connected, various aspects of toolautomation electronics can monitor the connection and determine when theconnections are in a safe operating mode. Such tool automationelectronics can communicate to the tool body 201 and to the tool chassis211 to identify a state that the connections and supply conduits are in.

In still another aspect of the invention, in some embodiments, controlautomation can be contained within the chassis for various aspects ofthe operation of the chassis 101. It is within the scope of the presentinvention to monitor and control multiple states related to the chassis101 via electronic included in the chassis 101. Such states can include,by way of example, a physical location of a chassis 101 in an extendedor closed state. Therefore, for example, if a processing tool 200 andchassis 101 are in a closed and operational state, a technical operatorissue a command to the chassis 101 to move to an extended location. Suchcommunication could occur through a control panel 122 or throughwireless communication to the chassis 101 through wireless receivers123. Control of the processing tools can be accomplished with any knownmachine controller technology, including for example a processor runningexecutable software and generating a human readable interface.

In some embodiments, a command to move to the chassis 101 to an extendedlocation can also initiate, amongst other algorithmic functions, a checkfor the status of utilities connections. It is also within the scope ofthis invention to require any such utility connections to be renderedinto a state of disconnect before the chassis 101 can proceed to anextended position.

Similarly, in some embodiments, prior to operations such as extension ofa chassis 101, processing steps can determine that a tool body 201 didnot contain any substrates prior to extension of the chassis 101. It isalso within the scope of the present invention for communication modesincluded within the chassis 101 to communicate with fab wide automationsystems for purposes such as tracking the location of substrates;tracking the identity of tools; and tracking the status of tools 200. Ifconnections to a tool 200 and chassis 101 are in a proper state then thechassis can move into an extended position allowing for removal of thetool body 201 and replacement with a similar tool body 201.

In some embodiments of the present invention, a fabricator will includeautomation to handle substrates and control their processing. And, inmany cases the substrates can move from tool to tool in a specializedcarrier which contains the substrates. The specialized carriers can betransported via automation which includes automated transport systems.The carriers can thereby be presented to one or more processing toolinterfaces, also referred to herein as a “port”. The automation allowsfor movement of the substrates around the fab and for loading andunloading the substrates from a processing tool. Substrates can include,for example and without limitation, wafers for semiconductor processing,microelectronic machines, nanotechnology, photonic, and biotechnologicalcarriers.

A substrate processing tool port can support processing tools and handlewafers and wafer carriers in an environment attached to the tool body.The tool port can penetrate a clean space containment wall and the toolbody can enable routine placement and replacement into the fabricatorenvironment.

As described above, according to the present invention, processing toolsreside with their tool bodies in a position which allows the tool bodyto be outside of a cleanspace with a tool port operatively attached tothe tool body inside of the cleanspace. For example, embodiments caninclude a tool body adjacent to, or on the periphery of, a clean spaceof the fabricator and the tool port extending into the cleanspace. Eachtool body can be removed and replaced in a standardized process andwithout requiring the removal of adjacent tool bodies. The presentinvention also anticipates the automated transfer of substrates from afirst tool port of a first processing tool to a second tool port of asecond processing tool, while maintaining the substrate in a clean spaceenvironment via a clean carrier.

Embodiments therefore include tool ports that are capable of receiving acarrier from the automated transport system. Each carrier can contain atleast one substrate. The automated transport unloads the carriers andpasses the carrier off to the processing tools automation systems. Insome embodiments, the port size enables it to span a wall used for thedefinition of a primary clean space of the fabricator. Inside theprimary clean space resides the entry area of the tool port. The toolport's body can span a distance in excess of the width of the cleanspace wall to allow for substrates which are unloaded from their carrierto be robotically handed off to the tool body's automation.

The novel tool port can incorporate various levels of automated carrierand substrate handling apparatus. For example, in some embodiments, thecarrier and handling apparatus can include communication systems whichreceive data from electronic sensors monitoring each port, processingtools and transport apparatus. In another aspect, a substrate can becontained within a controlled ambient environment while it is within thestorage carrier, port and processing tool.

Substrate Handling

Referring now to FIG. 6, the present invention provides methods andapparatus for handling substrate carriers in a way that is consistentwith routine placement and replacement of the processing tool body 604.A generic tool body 604 is illustrated which contains processingequipment for processes commonly used in fabricating semiconductordevices. The tool body 604 is illustrated with handles to clearlyindicate the ability of the tool body 604 to be removed from itsprocessing position. The tool port 601 extends from the processing toolbody 604. In some embodiments, the tool port 604 extends a sufficientdistance to traverse an associated clean room wall and be in positionfor the port entry or “mouth” 603 to receive and hand off substrates.

In some embodiments, the tool body 604 resides in a secondary cleanspace which is independent of the primary clean space. Separation of theprimary cleanspace and the secondary cleanspace is accomplished via asealing mechanism 602. The sealing mechanism 602 can include, forexample, a collapsible ring of material that when pushed against asealing surface forms an atmospheric seal.

Referring now to FIG. 7, tool body 704 is shown at a closer perspectiveincluding the seal 702 around the tool port 701 and side panels aroundthe inside removed.

FIG. 8 illustrates a close up of an embodiment of the internalcomponents of a tool port 601. A cassette loading and unloadingapparatus 810 is automatically operative to open a cassette (not shown)and insert or remove a substrate according to a software instructionreceived. A substrate wafer 811 is illustrated being removed from thecassette unloading apparatus 810. The substrate wafer 811 is shownsitting on a holder 812, such as, for example, a vacuum actuated holder.The holder 812 is connected to a retractable arm 813. The retractablearm 813 can be operative to move the holder 812 and a substrate into andout of a cassette 810. A rotation stage 814 supports the arm 813 and iscapable of positioning the arm 813 along an arcuate path.

In some exemplary embodiments, a cassette containing a substrate 811 isloaded by a fabricator automation robot into the “mouth” of a cassetteunloading apparatus 310. Inside the cassette unloading apparatus 810,the cassette can be opened, thereby exposing a substrate 811 containedthere. In some embodiments, the cassette maintains a clean spaceenvironment for the substrate 811 contained in the cassette. Inaddition, the environment of the unloading apparatus is also acleanspace thereby keeping the substrate 811 in a cleanspace environmentafter it is unloaded.

The retractable handler arm 813 extends into the cassette and securesthe substrate wafer 811 with an actuated attachment mechanism, such asfor example a vacuum tip. The retractable handler arm 813 is thenretracted back out of the cassette unloader. In some embodiments, theretractable handler arm 813 centers over the rotation platen 814. Arotation of 814 with the arm centered would lead to the minimum amountof space required. Once the arm has rotated towards the tool body, thearm can again extend allowing the wafer to be placed in a receivinglocation of the tool body 604. After processing, the substrate 811 canbe moved back to a receiving location and picked up by the handler 812.By reversing the above steps the substrate 811 can be transferred backto a carrier for handoff to the fabricator automation. The fabricatorautomation can transport the substrate to an additional processing toolfor further processing by the additional tool.

FIG. 9 illustrates perspective view of how a port according to thepresent invention is operatively attached to a tool which is easilyplaced and replaced. In some embodiments, a fabricator 901 has a seriesof stacked tools 902. When a tool 902 is being placed or replaced itsits in a retracted position 905 relative to a normal position 902 in afabricator. The tool body, 904, is shown in its retracted position, 905.As illustrated, the tool port 903 is located on a side of the tool body901 with the furthest edge just visible.

FIG. 10 shows a perspective of the fabricator 910 from the opposite sideillustrated in FIG. 9. The back fabricator walls have been cut away inorder to illustrate an inner portion of the fabricator 900, includingmultiple tool ports, such as, for example as exemplified by port 1001.Tool port 1001 is attached to a tool body 904 that is fully advancedinto the fabricator and in the normal position.

According to some embodiments, while a tool body is located in thenormal position, a seal is formed against the sealing surface 1002maintaining the integrity of the cleanspace into which the tool port1001 extends. As illustrated, the tool body 904 connected to the toolport 1001 extends away from the clean room wall 1010. In this position,the port 1001 is able to interface with transport automation 1013situated on a rail 1012. In some embodiments, a robot arm would indexfrom the transport automation 1013 to a correct tool port 1001 positionby moving horizontally on rail 1012 while that rail moved along thevertical rail system 1011. Any other known transport automation cansimilarly be employed to position the tool port 1001. When transportautomation 1013 is located in a programmed position, the transportautomation 1012 moves forward to hand a wafer cassette to the tool port1001.

In another aspect, the clean environment of fabricator 900 and eachindividual port 1001 can be facilitated by transporting equipment on therail 1012 to a port 1001 and open the port 1001 to flow liquids orgasses over the internal surfaces of the port 1001 in order tofacilitate particulate and film cleaning.

Substrate Carrier

Another aspect of the present invention includes a carrier forcontainment of a single substrate in a clean environment. The carrier iscapable of the transport of the single substrate inside and outside ofan environment for processing substrate wafers. The single substratecarrier is capable of interfacing with processing equipment which isdesigned specifically for single substrate processing as contrasted witha semiconductor lot of 13 to 25 substrates. In some embodiments, thecarrier can be loaded and unloaded by application of opposite force toits top and bottom plate for access to a substrate contained therein.Some embodiments can also include electronics for information, such asthe identification and status of a wafer contained therein and for wiredor wireless communication. Some embodiments can also include a carrierincluding environmental control equipment.

According to the present invention, a fabricator is provided forefficient production of lot size of a single wafer. Although designs ofcarriers exist to carry a single substrate at a time, these carriers arenot made for the purpose of processing the substrates, but rather fortransporting a wafer out of a processing line for testing, finishing orother purposes. The present invention provides methods and apparatus fora carrier of a single substrate wafer which maintains the substrate in aclean environment.

The novel single substrate processing carrier according to the presentinvention can incorporate various levels of automation to interface witha modem fabrication facility. For example. according to the presentinvention, a single substrate carrier can include electronic circuitryfor communication of data from the carrier to other systems that caninclude, for example, processing tools and fabricator wide automationsystems. Furthermore, in some embodiments, single substrate processingcarrier can provide and maintain environmental control of the singlesubstrate stored. Environmental control can include, for example,temperature and humidity control.

In another aspect, since a single substrate is the minimum entity sizethat can be processed at a time; a single wafer carrier according to thepresent invention can serve the purposes of both a processing carrier ina fabricator environment; and, a shipping carrier external to theenvironment. Further embodiments can also include a single substratecarrier which allows for single carrier to store a substrate inprocessing of the substrate, test of the substrate, as well as packagingand diagnostic environments for the substrate.

Referring now to FIG. 11, according to the present invention, a carrier1101 is provided which can contain a single substrate 1140 at a time andwhich can easily be transported to automated processing ports. In someembodiments, the carrier 1101 includes a box like shape having sidepanels 1130 and 1131, top panel 1120 and bottom panel 1124. In theseembodiments, three box-like regions are defined. A main region 1124where the substrate 1140 is contained and two exterior regions 1150where spring-like material 1110 is contained. Other embodiments caninclude cylindrical or non-uniform shapes and defined regionsaccordingly.

According to the present invention, during containment in the carrier1101, substrate, 1140, resides in a contained clean environment; and isable to be removed and replaced from the clean environment withoutviolating the integrity of the clean environment. Therefore, the presentinvention provides for an external handling unit engaging the top plate1120 and the bottom plate 1124 and moving them apart. During suchmovement, the springs 1110 deflect allowing for separation of end sides1130-1131 from an attached panel, such as the bottom plate 1124. Twolateral sides 1150 and 1151 and pieces of the other sides 1132 remainfixed to the bottom plate 1124, while sides 1131 and 1133 remain fixedto the top plate 1120. Sealing material, such as a pliable synthetic,silicone or a foam material can border the corresponding surfaces of thetop plate 1120 and bottom plate 1120 where the non-attached sides 1131,1133 make contact.

A set of rails 1123 within the carrier 1101 can provide support forsubstrate item 140. A set of sloped surfaces attached to the rails 1121facilitate the location of the substrate by transfer automation in a fab(not shown). The force of springs 1110 can return the top plate 1120 andthe bottom plate 1124 to their respective storage positions. In thestorage position, the various sealing surfaces 1122 are placed in aclosed position. A securing device, such as, for example, a set of clips(not illustrated) can secure the top edge of a substrate 1140 placedwithin the carrier 101 and hold the substrate 140 in place while it iscontained within the carrier 1101.

Referring now to FIG. 12, a side elevation illustrates the spatialrelationship of several components implementing one version of thepresent invention 1201. As illustrated, a substrate, 1240 is supportedby a set of rails 1220. Sloped guides 1221 proximate to the rails aid inlocating the substrate. Channels 1210 are located separate from thesubstrate chamber 1222. The channels can contain springs 1211 whichfacilitate opening and closing of the carrier 1201. In some embodiments,clips, finger springs or other securing mechanism 1230 push down on asurface of the substrate, 1240 securing the substrate against the rails1220.

An alternative embodiment is shown in FIG. 13 as item 1301. Thisalternative shares substantially the features of the embodiments ofFIGS. 1 and 2. However, in the embodiments illustrated in FIG. 13, apocket 1311 roughly the same shape as the substrate (not illustrated inFIG. 13) is provided to receive the substrate. The pocket, 1311 isdefined as a cutout in pieces of a rail 1310 which supports thesubstrate away from the bottom of the carrier. Similar to the precedingexamples, finger springs or clips 1320 provide force on the edge of asubstrate when the carrier is in a closed configuration and secure thesubstrate in place against the rails 1311.

FIG. 14 shows a depiction of an embodiment of a carrier 1401 with apocket 1411 to hold the wafer in an open position. Springs 1412, areshown in an extended position with the top plate and sides of thecarrier are moved away from the back plate, item 411.

FIG. 15 shows a side view of some embodiments of an open carrier 1501.The carrier 1501 can be held in the open position while a substrate (notillustrated in FIG. 15) is being moved into or out of the carrier 1501.An access path for a substrate is formed when the top plate 1515 andbottom plate 1511 are moved apart from each other.

The rails, 1510 and pocket 1512 can be affixed to the bottom plate 1511to allow a gap to be formed underneath the substrate. A handling arm canextend into the gap and removably attach to the substrate, for exampleby using a vacuum tip. The handling arm can lift the substrate and withhorizontal movement of the arm retract out of the pocket. Afterretraction of arm, the carrier resumes a closed position under theaction of the springs 1514.

Referring now to FIG. 16, in some embodiments, the relative size ofrobotics, or other spatial considerations, may make it advantageous toutilize two levels of spring attached plates 1610-1611 with a middleplate (not shown in this view). Springs 1613 can be seen in this casefor the opening of the top level 1610. A lower level, 1611 is identifiedthat can move down, with springs that are not shown, relative to thelocation of a fixed plate which can be attached to a hard fixture, 1612.

Referring now to FIG. 17, a two level carrier 1701 is shown in an openposition. The elevation view now makes apparent, the second level ofsprings 1713 used to support the bottom level, 1712. The top level 1710is held by springs 1712. The middle plate 1711 is the support surfacefor the substrate.

In some embodiments, an additional aspect includes a set of vent holes1720 that are located in the top plate 1710 of the carrier. The venthole can allow for equipment to control the ambient temperature of thesubstrate to be attached as an integral part of the carrier.

A side view of an open carrier 1801 is shown in FIG. 18. A gap definedas the bottom of the substrate 1821 and the top of the bottom level 1814can be much larger than that of a single level carrier due to the extramovement allowed by springs 1813. Vent holes 1830 can be placed in thetop plate of the carrier 1810. It should be noted that such vent holescan be made into the top of any of the various carrier embodiments FIGS.11-18 in a similar fashion.

Referring now to FIG. 19, an elevation of a closed dual level carrier,1901 is illustrated. A bottom level, 1912 and the top level 1911 areboth shown in a closed position relative to an affixed wafer level item1913. In some embodiments, an environmental control entity 1910 can beschematically shown attached to the top plate of the carrier. Such acontrol entity 1910 can be operative to move airflow through one set ofvent holes in the top plate, process the air, for among other factorsits humidity, and then flow the air back into the carrier environmentthrough another set of holes.

Addition of communication and power entities can also be incorporatedinto the various carrier designs. Specific placement of such entities isnot limited; however, for the purpose of illustration the embodimentsillustrated in FIG. 19 can be used for discussion. When item 1901 isbeing held inside an automation piece of equipment, it can be envisionedthat the components of level 1913 can be held in a fixed position by thee external automation, while moving pieces of the automation attach toappropriate parts of the top level 1911 and the lower level 1912 byvacuum for example. Channel 1913 can contain electronic circuitry tocontrol, for example: wired communications, wireless communication,handling, and ambient environment conditions. In a wired sense, theparts 1913 in fixed contact with the handling units can determine theinterface faces for such connection. Furthermore, storage batteriesresiding in spaces of item 1913, can also be charged up using a similarfixed contact or alternatively, power, can be transferred viaelectromagnetic fields from the automation equipment to receivingelectronics inside the space of the carrier.

Embodiments of the carrier innovation have been depicted forillustration in the various figures with springs shown as bands ofmaterial. The generality of the design should be apparent to encompassvarious types of spring-like material. To illustrate such a variation,FIG. 20 shows an elevation, 2001 of a single level carrier with a pocketdesign having helical type springs 2010. For illustration, such springscan be attached from the top plate 2020 to the bottom plate 2021.Further enhancements such as, for example, sheaths around the springs tocontain contamination debris that may be released under movement of thesprings is not shown, for clarity of the illustration, but can easily beenvisioned as enhancing some embodiments' function as a clean carrier ofthe substrate, and are therefore within the scope of the presentinvention.

In various other aspects of the present invention, carriers according tothe present invention can be used in the processing of: semiconductorsubstrates, microelectronic machines, nanotechnology, photonic, andbiotechnological applications. Equipment can be incorporated into portsof processing tools to allow for the opening and closing of the carrier.Since substrates can also be transported in the carrier, stand-aloneunits for the loading and unloading of substrates without the presenceof a processing tool are also within the scope of the present invention.Since the clean environment of the carrier can need to be maintained, itcan also be expected that equipment that can clean the carrier can bemade consistent with these design concepts. Stand-alone units that openthe single substrate carrier and flow liquids or gasses over theinternal surfaces to effect particulate and film cleaning are alsowithin the scope of the present invention.

Utility Flange Connectors

When installing a processing tool into a semiconductor fabricator, thereare a number of different connections which need to be made to provideutilities, data connections and materials through conduits from thefabrication facility support infrastructure to the individual processingtools. In that traditional processing tools reside in their respectiveplaces, typically for the life of the tool, historically there has notbeen standardized accommodation for an organized placement of theseconnections in a manner that allows them to be quickly coupled. However,the present invention anticipates routine placement and replacement ofprocessing tools and therefore provides for quick coupling anduncoupling of multiple connections. Specifically, the present inventionprovides methods an apparatus which allow for the repeatable removal andreplacement of processing tooling without the need to weld, glue orotherwise permanently reconstitute conduit connections during eachreplacement.

In another aspect of the present invention, a physical framework isprovided for quick standardized connections of materials and utilitiesto processing tools. Each processing tool can be conceptualized as a“Box” with various processes and operations occurring inside the box.Particular processes and operations are generally unimportant to thisdisclosure, except in that they define the need for the input and outputof materials, utilities, data connections and waste relative to each“Box” to support its operation. The general classes of the materials,utilities and waste relevant to this concept can be liquid chemicals,gaseous chemicals, vacuum, cooling liquids, and utility gas flows forcooling or exhaust. FIG. 21A illustrates exemplary connections between a“Box” and the facility infrastructure.

General classes of materials can each have their own set of technicalneeds based upon requirements for safe operation, process integrity,cost effectiveness or other related concern. A first class fordiscussion can include gaseous chemicals. Such chemicals can be furthersub-classified for example as inert, reactive, toxic or pyrophoric or acombination of these. Each sub-classification can have the property ofbeing provided under an elevated pressure with high degrees of purity.Thus a means of quickly coupling and decoupling gaseous chemicals willneed to address various needs and properties of each classification.

In FIG. 21A a top view of a flange 2101 according to the presentinvention is presented. The top view illustrates one of two separatedsealing surfaces 2110, which, when joined together, seal and provide thesealed connection of the multiple gas conduits that are connected. Thisone side is illustrated to have an external sealing surface indicated as2110. On this sealing surface 2110 is accommodation by either a knifeedge or channel for an “O-Ring” seal 2111. Other sealing apparatus, suchas a gasket, or malleable ring, may also be used. Moving towards thecenter, the outer external sealing surface is interrupted by a channel2112. This channel 2112 allows for the evacuation of air in the internalregion of the seal 2111. Negative atmospheric pressure, such as arelative vacuum, may be established through ports 2114 connecting to thechannel.

Electronic monitoring of the vacuum state can be used to facilitatesafety, wherein any change in the vacuum state can be assessed todetermine if the change denotes a safety hazard or an indication ofimpurities mixing with gases or materials passing through the flange2101. The application of a vacuum can facilitate safe use of the flange2101 during operation and through detection of any leaks in sealingsurfaces. Furthermore, miniscule leaks that may be small enough toeffect process cleanliness but not large enough for general detectionwill not result in foreign gases being introduced.

On an inner side of channel 2112 is a second surface 2115 on whichmultiple conduit sealing junctions 2116 can be arrayed. Each sealingjunction 2116 can include a pliable seal, O-ring, brass ring or otherinterface device capable of forming a gaseous seal. In some embodiments,each sealing junction 2116 can be constructed so that it has the sameplanar height as the external sealing surface 2110. Embodiments withessentially planar sealing surface heights will invoke a positivesealing aspect with O-ring 2111 and at the same time force individualgas line O-rings 2116 to seal.

A second radial sealing surface 2115 can terminate with a second channel2119. Channel 2119 can be evacuated with a port 2118 to establish avacuum condition on either side of the gas line conduit sealing region.In this manner an individually sealed conduit line 2113 (FIG. 21 B) canbe connected to its counterpart on a mating piece allowing for acontinuous connection at this entity. Since the region around eachconduit's sealing interface 2117 is surrounded by a vacuum, safeoperations can be assisted. Furthermore, if the vacuum system isconnected with vacuum gauges or in situ mass spectrometers then a leakbetween any of the sealing surfaces can be detected and all gases shutoff with electrically activated valves and a corresponding diagnosticmessage can be sent. In some embodiment, pneumatic valves or otherautomated valves may also be utilized.

In some embodiments, safe operations can further be enhanced by theincorporation of an electronic ID tag (not illustrated). The tags canuniquely identify each flanging mechanism half. Control electronicscapable of interacting with the ID tags can then ensure that the gaslines that will be connected are appropriate.

Referring now to FIG. 21B a view from the bottom of a flange 2102 forjoining multiple gas lines 2113 is illustrated. The flange 2101 caninclude a bottom of the external sealing surface 2130 and a set of innervacuum channels. A connection to the external channel can include a tube2131 which interfaces with a vacuum line 2137. Each tube 2134 which endswith a vacuum flange 2136 can act both for support of the flangemechanism 2102 and for a conduit of vacuum the inner part of which isshown as 2137. Each of the individual gas lines 2113 can penetrate theflange mechanism 2133.

FIG. 22 illustrates some embodiments with two corresponding halvessealed together 2201. A first flange 2210 which can be considered the“Facility side” flange 2210 correlates with connections from conduitsthat run from various locations in the facility to the process tool.There is also a flange 2211 that can be considered the “Tool side”wherein each facility conduit can have a corresponding conduit bring amaterial into the process tool. Input gas conduits 2212 are connected totool gas conduits 2214 in this manner. On the facility side a vacuumsource 2213, or other negative atmospheric pressure source, can beconnected to a vacuum flange which will both rigidly support the flange2211 and convey vacuum. In some embodiments, the vacuum source is alsoconnected to the two channels in the flange as shown with 2215.

Referring now to FIG. 23, a bottom view of a mated set of flanges isillustrated 2301. As described above, a facility side flange piece 2312can mate with a tool side flange 2311. In these embodiments, a vacuumsource 2315 can connect with a rigid tube and flange 2314. In someembodiments, flexibility for tolerances in the plane that the flangesurface resides in can be incorporated into a corresponding tool sideflange 2311. A flexible ball joint type coupling 2310 on a shaft 2316which will allow for some movement to align flange pieces 2311-2312.Once the flanges 2311-2312 are mated together the facilities sideconduits 2313 are again joined to their corresponding tool side conduits2316.

Referring now to FIG. 24, in some embodiments, two flanges 2414, 2416can be joined together with enough compressional force onto facilityflange 2414 and tool flange 2416 to close a gap between them 2415. Thiswill put compressional force onto the O-Ring seals shown in FIG. 21items 2111 and 2116 to ensure an integral seal. In some embodiments,threaded bolts 2420-2426 can be used to apply the requisitecompressional force. The bolts 2420-2426 can tighten into previouslytapped holes in the tool side flange 2416, or with threaded nuts (notshown) mated on an opposite side of the flange 2401. One of the bolts2426 is illustrated for reference in a non-tightened position. Dependingon the nature of the O-ring material, the torque on each of the bolts2420-2426 can be adjusted to ensure all sealing surfaces are leak proof,in which case corresponding gasses can flow without leaks either out ofor into the conduits that are joined together 2411, 2417.

Referring now to FIG. 25, in some additional embodiments, a clampingmechanism 2511 can include opposing faces 2510 and 2512 with bevelededges. The opposing edges 2510 and 2512 can be tightened togethercausing compressional force to be placed on the two flange faces2516-2517 and thereby force the flanges 2516-2517 together and sealinternal o-rings (not shown). In some exemplary embodiments, clamp 2511is pulled together with a wing nut assembly 2515. When the wing nutassembly 2515 is tightened, capturing face 2513 is drawn towards anopposing face or other holding point 2514. The wing nut assembly 2515can be held, for example, on an axle shown as 2518.

Referring now to FIG. 26, in some embodiments, an automated flangesealing mechanism can be operated, for example, via an electric orpneumatic motor. For example, a lead screw 2632 attached to a steppingmotor or a pneumatic motor 2634 can put force on brackets 2630 and 2631compressing them together and thereby pushing the clamps around the twosealing flanges 2610. Embodiments can therefore include the capturingdevice 2611 with shafts 2622, 2623 that can guide linear movement of thetwo sealing flanges 2610. In much the same way by bringing the twoflanges together a compressional force will act on the O-rings thuscreating a seal between the O-rings and the flange faces.

Referring now to FIG. 27, flange devices that have been shown thus farhave allowed for multiple gas conduits to be rapidly connected andunconnected. As previously mentioned, in some embodiments, it ispossible to have gasses that are either highly toxic or have othersafety issues that make it more desirable to isolate the gas fromothers. In FIG. 27 a device 2701 implementing the concepts of thepresent invention for a single gas line is illustrated. The facilitiesside of a single gas line 2710 and a tool side of the gas line 2711 canbe joined with a flange 2701. Furthermore, as discussed above, theflange 2701 can still have accommodation for an evacuated channelsurrounding the gas interface seal. The vacuum for the channel can againbe provided by a flange to tube connection 2714 that will provide bothphysical support and also a source of negative atmospheric pressure.

Referring now to FIG. 28, in general, processing tools may requireconnections to materials other than gasses. One type of additionalmaterial includes liquid chemicals. The fundamental aspects ofimplementations of the present invention directed to carrying liquidsare similar to those described above for gases. Depending on thematerial in question it may be desirable to provide multiple connectionsthrough the same flange or as is illustrated in FIG. 8 a single liquidchemical. Aspects which depend on the nature of the chemical to beconveyed can include, for example: the material comprising the flange,a-rings, and connections can be designated to ensure chemicalcompatibility. Accordingly, while a typical material for construction ofa device to convey gasses can be stainless steel, a material forconstruction of a device to convey a liquid chemical can be Teflon.

A connector 2801 to chemical lines on the tool side of the interface canconnect an output line 2821 of a flange 2810 according to the presentinvention to a processing tool supply line. The flanging device willhave a tool side flange 2810 and a facilities side flange 2811 as well.Chemical input to the flange will likewise be done with line 2812 andconnector 2813. Instead of the vacuum shown in the gas devices achemical drain connection can be used to both detect and safely containleaks. Item 2831 is indicated to show a channel connection that willconnect tube 2832 to a drain channel (not shown in FIG. 28) existing onthe inside of the flange pieces 2810 and 2811. The drain can beconnected to a facilities drain system with tube 2832 and connector2830.

Referring now to FIG. 29, embodiments of the present invention includinga flange 2901 which incorporates draining functionality is illustrated.A cutaway of a facilities side flange face 2930 shows both sealingsurfaces 2931-2932 and channels 2933-2934. Exterior sealing surface 2929incorporates a-ring 2931 for sealing. Channel 2934 is formed into theflange 2930 to allow for draining. On the other side of the channel is asecond sealing surface 2928 and a-ring 2932. The second sealing surface2928 is what will seal the chemical channel 2933 on both flange surfacesso that the flange assembly 2901 can convey a chemical.

In some embodiments, automated chemical detectors can provide an alertto a situation of a chemical leak in the sealing surface 2928. In ananalogous fashion to the vacuum system with gasses such detectors canalso be operative to automatically shut off the chemical flow to theflange with appropriate valves.

Referring now to FIG. 30, the ability of flanges 2101-2901 to conveyboth liquids and gasses and to accommodate vacuum and chemical drainsenables a combination of multiple flanges 2101-2901 of the above designtypes, to be assembled and thereby provide an integrated package forquick connect and disconnect of process tooling from the fabenvironment.

To illustrate a quick disconnect multiport, FIG. 30 shows a combinationof a multiport gas flange interface 3010, a single gas flange 3011 and asingle chemical interface 3012. By combining multiple flanges into asingle entity 3001, flange closure devices 3020 and 3021, which can beoperative to ultimately apply compression to a-ring seals contained inthe respective flanges 3010, 3011, and 3012. For example, operation offlange closing devices 3022 can be operative to engage multiplecompressive closure devices in a single action. Specific examples caninclude a threaded nut 3023 that can be tightened to provide closureforce and assemble and seal three different flanges 3010, 3011 and 3012.

It is to be understood, that although various specific embodiments havebeen described, including a multipart flange 3001, individual nuts asshown as item 2410 in FIG. 24, or with a motorized lead screw solution2633 illustrated in FIG. 26, various other embodiments, including acombination of flanges 2101-2901 can constitute all the materials inflowand outflow to a processing tool. A processing tool can therefore beconnected through an interface that is quickly assembled anddisassembled as might be the case when a tool is routinely beinginstalled or removed from a cleanspace position.

Referring now to FIG. 31, a block diagram illustrates exemplaryfunctionality that can be provided to a processing tool 3101 via asingle quick disconnect coupling mechanism 3107. For example, in someembodiments, two or more of: facility vacuum 3102, facility exhaust air3103, facility chemical drains 3104, facility chemicals 3105 andfacility gasses can be connected and disconnected via a single couplingmechanism 3107 or flange.

Some embodiments of the present invention which relate to the specificapplication of semiconductor fabrication have been described in order tobetter demonstrate various useful aspects of the invention. However,such exemplary descriptions are not meant to limit the application ofthe inventive concepts described herein in any way. Embodiments maytherefore include, for example, applications in research and generationof: pharmaceutical products, nanostructure products and otherapplications which benefit from the availability of cleanspace andmultiple processing tools.

Glossary of Selected Terms

-   -   Air receiving wall: a boundary wall of a cleanspace that        receives air flow from the cleanspace.    -   Air source wall: a boundary wall of a cleanspace that is a        source of clean air flow into the cleanspace.    -   Annular: The space defined by the bounding of an area between        two closed shapes one of which is internal to the other.    -   Automation: The techniques and equipment used to achieve        automatic operation, control or transportation.    -   Ballroom: A large open cleanroom space devoid in large part of        support beams and walls wherein tools, equipment, operators and        production materials reside.    -   Batches: A collection of multiple substrates to be handled or        processed together as an entity    -   Boundaries: A border or limit between two distinct spaces-in        most cases herein as between two regions with different air        particulate cleanliness levels.    -   Circular: A shape that is or nearly approximates a circle.    -   Clean: A state of being free from dirt, stain, or impurities—in        most cases herein referring to the state of low airborne levels        of particulate matter and gaseous forms of contamination.    -   Cleanspace: A volume of air, separated by boundaries from        ambient air spaces, that is clean.    -   Cleanspace, Primary: A cleanspace whose function, perhaps among        other functions, is the transport of jobs between tools.    -   Cleanspace, Secondary: A cleanspace in which jobs are not        transported but which exists for other functions, for example as        where tool bodies may be located.    -   Cleanroom: A cleanspace where the boundaries are formed into the        typical aspects of a room, with walls, a ceiling and a floor.    -   Core: A segmented region of a standard cleanroom that is        maintained at a different clean level. A typical use of a core        is for locating the processing tools.    -   Ducting: Enclosed passages or channels for conveying a        substance, especially a liquid or gas—typically herein for the        conveyance of air.    -   Envelope: An enclosing structure typically forming an outer        boundary of a cleanspace.    -   Fab (or fabricator): An entity made up of tools, facilities and        a cleanspace that is used to process substrates.    -   Fit up: The process of installing into a new clean room the        processing tools and automation it is designed to contain.    -   Flange: A protruding rim, edge, rib, or collar, used to        strengthen an object, hold it in place, or attach it to another        object. Typically herein, also to seal the region around the        attachment.    -   Folding: A process of adding or changing curvature.    -   HEPA: An acronym standing for high-efficiency particulate air.        Used to define the type of filtration systems used to clean air.    -   Horizontal: A direction that is, or is close to being,        perpendicular to the direction of gravitational force.    -   Job: A collection of substrates or a single substrate that is        identified as a processing unit in a fab. This unit being        relevant to transportation from one processing tool to another.    -   Logistics: A name for the general steps involved in transporting        a job from one processing step to the next. Logistics can also        encompass defining the correct tooling to perform a processing        step and the scheduling of a processing step.    -   Multifaced: A shape having multiple faces or edges.    -   Nonsegmented Space: A space enclosed within a continuous        external boundary, where any point on the external boundary can        be connected by a straight line to any other point on the        external boundary and such connecting line would not need to        cross the external boundary defining the space.    -   Perforated: Having holes or penetrations through a surface        region. Herein, said penetrations allowing air to flow through        the surface.    -   Peripheral: Of, or relating to, a periphery.    -   Periphery: With respect to a cleanspace, refers to a location        that is on or near a boundary wall of such cleanspace. A tool        located at the periphery of a primary cleanspace can have its        body at any one of the following three positions relative to a        boundary wall of the primary cleanspace: (i) all of the body can        be located on the side of the boundary wall that is outside the        primary cleanspace, (ii) the tool body can intersect the        boundary wall or (iii) all of the tool body can be located on        the side of the boundary wall that is inside the primary        cleanspace. For all three of these positions, the tool's port is        inside the primary cleanspace. For positions (i) or (iii), the        tool body is adjacent to, or near, the boundary wall, with        nearness being a term relative to the overall dimensions of the        primary cleanspace.    -   Planar: Having a shape approximating the characteristics of a        plane.    -   Plane: A surface containing all the straight lines that connect        any two points on it.    -   Polygonal: Having the shape of a closed figure bounded by three        or more line segments    -   Process: A series of operations performed in the making or        treatment of a product—herein primarily on the performing of        said operations on substrates.    -   Robot: A machine or device, that operates automatically or by        remote control, whose function is typically to perform the        operations that move a job between tools, or that handle        substrates within a tool.    -   Round: Any closed shape of continuous curvature.    -   Substrates: A body or base layer, forming a product, that        supports itself and the result of processes performed on it.    -   Tool: A manufacturing entity designed to perform a processing        step or multiple different processing steps. A tool can have the        capability of interfacing with automation for handling jobs of        substrates. A tool can also have single or multiple integrated        chambers or processing regions. A tool can interface to        facilities support as necessary and can incorporate the        necessary systems for controlling its processes.    -   Tool Body: That portion of a tool other than the portion forming        its port.    -   Tool Port: That portion of a tool forming a point of exit or        entry for jobs to be processed by the tool. Thus the port        provides an interface to any job-handling automation of the        tool.    -   Tubular: Having a shape that can be described as any closed        figure projected along its perpendicular and hollowed out to        some extent.    -   Unidirectional: Describing a flow which has a tendency to        proceed generally along a particular direction albeit not        exclusively in a straight path. In clean air flow, the        unidirectional characteristic is important to ensuring        particulate matter is moved out of the cleanspace.    -   Unobstructed removability: refers to geometric properties, of        fabs constructed in accordance with the present invention, that        provide for a relatively unobstructed path by which a tool can        be removed or installed.    -   Utilities: A broad term covering the entities created or used to        support fabrication environments or their tooling, but not the        processing tooling or processing space itself. This includes        electricity, gasses, air flows, chemicals (and other bulk        materials) and environmental controls (e.g., temperature).    -   Vertical: A direction that is, or is close to being, parallel to        the direction of gravitational force.

While the invention has been described in conjunction with specificembodiments, it is evident that many alternatives, modifications andvariations will be apparent to those skilled in the art in light of theforegoing description.

Accordingly, this description is intended to embrace all suchalternatives, modifications and variations as fall within its spirit andscope.

What is claimed is:
 1. A method of producing substrate materialcomprising: fixing an apparatus for placing a tool body and a tool portin a fabrication facility comprising a clean space, wherein theapparatus comprises: a chassis supporting a base plate for mounting afabrication tool onto, said chassis comprising an extended position andan operating position; a base plate attached to the chassis, said baseplate comprising a mating surface for receiving the tool body; a fixedplate for positioning the base plate in the closed position, whereinwhen the chassis is in the operating position, the tool port is sealedwithin a primary cleanspace and the tool body is exterior to the primarycleanspace; placing the chassis into the extended position to receive atool body; placing a fabrication tool comprising a tool body with a toolport upon the chassis; moving the chassis with fabrication toolthereupon into the operating position, wherein the tool port ispositioned into a primary cleanspace portion of a cleanspace fabricationfacility; and processing a substrate within the tool body.
 2. The methodof claim 1 additionally comprising the steps of: placing a substratecarrier comprising a substrate into connection with the tool port. 3.The method of claim 2 additionally comprising the step of: moving thesubstrate from the tool port to the tool body with automation.
 4. Themethod of claim 1 wherein the material upon the substrate comprises asemiconductor.
 5. The method of claim 4 wherein the processingcontributes to the production of an integrated circuit.
 6. A method ofinstalling processing tools within a cleanspace fabrication facilitycomprising: fixing an apparatus for placing a tool body and a tool portin a fabrication facility comprising a clean space, wherein theapparatus comprises: a chassis supporting a base plate for mounting afabrication tool onto, said chassis comprising an extended position andan operating position; a base plate attached to the chassis, said baseplate comprising a mating surface for receiving the tool body; a fixedplate for positioning the base plate in the closed position, whereinwhen the chassis is in the operating position, the tool port is sealedwithin a primary cleanspace and the tool body is exterior to the primarycleanspace; placing a chassis into an extended position to receive atool body; placing a fabrication tool comprising a tool body with a toolport upon the chassis; and moving the chassis with fabrication toolthereupon into an operating position, wherein the tool port ispositioned into a primary cleanspace portion of a cleanspace fabricationfacility.
 7. The method of claim 6 additionally comprising:communicating data between the tool body and tool chassis by a wirelesstransfer.